'Recognizing the need is the primary condition for design.'
Aims of the module:
1 Know the design processes and production methods used in the manufacture of a printed circuit board
2 Understand the use of software and thermal analysis techniques in the design, simulation and manufacture of an electronic circuit
3 Understand the use and application of surface mount technology in the manufacture of an electronic circuit
4 Be able to design, manufacture, assemble and test a prototype printed circuit board for a given electronic circuit.
Use the functions in ISIS to show your work in regards to dissapating high heat areas on the board and discuss methods of component seperation and how you have adapted your board layout in consideration of this.
Deveop an evaluation grid and populate it, analyse the resulting information in regards to your curcuit prototype and create a plan for mass manufacture including component list, supplier, assembly and QA testing.