'Recognizing the need is the primary condition for design.'

Charles Eames

'To design is to communicate clearly by whatever means you can control or master.'
Milton Glaser

Electronic Circuit Design and Manufacture

Aims of the module:

 

1 Know the design processes and production methods used in the manufacture of a printed circuit board

 

2 Understand the use of software and thermal analysis techniques in the design, simulation and manufacture of an electronic circuit

 

3 Understand the use and application of surface mount technology in the manufacture of an electronic circuit

 

4 Be able to design, manufacture, assemble and test a prototype printed circuit board for a given electronic circuit.

P1 describe the processes used in the design of both a single and multi-layer PCB for electronic circuits of different complexity

P2 describe typical production methods used in the manufacture of both a single and a multi-layer PCB for electronic circuits of different complexity

P3 describe how computer aided design software is used to analyse an electronic circuit prior to manufacture

P4 explain the need for thermal analysis and effective heat dissipation for an electronic circuit

P5 explain the use of SMT in the manufacture of an electronic circuit and give two examples of the outlines and packages used for surface mounted devices

P6 describe methods used for the manufacture of an electronic circuit using SMT

P7 design, manufacture and test a prototype printed circuit board for a given electronic circuit. 

M1 explain the benefits of using automated techniques for the manufacture of an electronic circuit and M3 explain the use of typical quality assurance methods in the manufacture of electronic circuits using SMT.

Inspection techniques PCB and SMT.docx
Microsoft Word document [16.6 KB]

D1 apply thermal analysis techniques in order to determine the heat dissipation requirements for the electronic circuit

Use the functions in ISIS to show your work in regards to dissapating high heat areas on the board and discuss methods of component seperation and how you have adapted your board layout in consideration of this. 

D2 evaluate the design and manufacture of the prototype PCB and circuit and make appropriate recommendations for mass production

Deveop an evaluation grid and populate it, analyse the resulting information in regards to your curcuit prototype and create a plan for mass manufacture including component list, supplier, assembly and QA testing. 

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© Julian Kupper